Specification：0.16mm*300mm*50m , 0.16mm*300mm*76m
Material：die-cutting, roll, with adhesive and without adhesive
Applicable：Power semiconductor, IS MOS tube IGBT chip
BM-k6 Thermal Sil Pad is a high thermal conductive insulation material, surface smooth, clean, no oil and soft, silicone materials by high stability and high thermal conductivity of inorganic powder as a filler, Kapton as intermediate carrier at the same time, strengthen the insulation and thermal conductive.
BM-k6 Thermal Sil Pad has high insulating strength, widely used in various thermal insulation occasions, typical applications in a variety of electronic device and the radiator or between other heat dissipation parts. This type product is mainly used between the heat source and the radiator.
1.Heat resistance : 0.56℃-in2/W (@ 50psi)
2.Lower fastening pressure
3.Smooth and height of the surface
4.Good electrical insulation
◆Large power source and automobile electronic heating module◆Motor control, communication equipment
◆Heating power device
Performance Description: K series thermal sil pad is using of special polyimide film as insulating material, therefore has the advantages of high strength voltage resistance, durability. These series products combine good thermal conductivity of silicone rubber with excellent physically performance polyimide film into high-end products.